Patents

US08488640

Integrated optical comb source system and method

US08300994

Transmitter photonic integrated circuit (TxPIC) chip

US07978981

Structure and apparatus for a very short haul, free space, and fiber optic interconnect and data link

US07885492

Transmitter photonic integrated circuit (TxPIC) chips

US07792396

Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use

US07773837

Monolithic transmitter photonic integrated circuit (TXPIC) with a transversely disposed output

US07747114

Tilted combiners/decombiners and photonic integrated circuits (PICs) employing the same

US07680368

Monolithic transmitter photonic integrated circuit (TxPIC) with a traversely disposed output

US07672546

Optical transport network having a plurality of monolithic photonic integrated circuit semiconductor chips

US07555220

Chromatic dispersion compensator (CDC) in a photonic integrated circuit (PIC) chip and method of operation

US07519246

Photonic integrated circuit (PIC) chips

US07512295

Transmitter photonic integrated circuits (TXPICS) with directly modulated lasers and wavelength selective combiners

US07477807

Monolithic transmitter photonic integrated circuit (TxPIC) semiconductor chip

US07444048

Tilted combiners/decombiners and photonic integrated circuit (PIC) employing the same

US07437029

Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip

US07340122

Monolithic transmitter photonic integrated circuit (TxPIC) with integrated optical components in circuit signal channels

US07295589

Frequency modulated vertical cavity laser

US07283694

Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs

US07236656

Optical transport network

US07158699

Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC)

US07135382

In-wafer testing of integrated optical components in photonic integrated circuits (PICs)

US07129100

In-wafer testing of integrated optical components in photonic integrated circuits (PICs)

US07123786

Compact, cost-effective optical-electrical-optical (OEO) converter for an optical transmission network

US07116851

Optical signal receiver, an associated photonic integrated circuit (RxPIC), and method improving performance.

US07116694

Transmitter array with pixel element that has primary semiconductor laser and at least one secondary semiconductor laser.

US07092425

VCSEL device with improved modal properties

US07079718

Optical probe and method of testing employing an interrogation beam or optical pickup

US07058263

Optical transport network

US07058246

Transmitter photonic integrated circuit (TxPIC) chip with enhanced power and yield without on-chip amplification

US07050719

Wavelength division multiplexing receiver for wavelength tracking

US07049570

Optical chip coupling system utilizing micromachine adjustable optical elements and a feedback circuit providing the micromachine with a feedback signal correlated to an optical signal parameter

US07043109

Method of in-wafer testing of monolithic photonic integrated circuits (PICs) formed in a semiconductor wafer

US07027703

Method for forming and apparatus comprising optical waveguides leading to a free space coupler region

US07006719

In-wafer testing of integrated optical components in photonic integrated circuits (PICs)

US06999489

Electrical isolation of optical components in photonic integrated circuits (PICs)

US06985648

Method of in-wafer testing of monolithic photonic integrated circuits (PICs) formed in a semiconductor wafer

US06922422

Heat isolation and dissipation structures for optical components in photonic integrated circuits (PICs) and an optical transport network using the same

US06839370

Optoelectronic device using a disabled tunnel junction for current confinement

US06804271

Light emission methods and light emission devices.

US06771682

Electrical isolation of optical components in photonic integrated circuits (PICS)

US06465811

Low capacitance bond pads for high speed devices.

WO 01/04951 A1

Low capacitance bond pads for high speed devices.

US06341138

Constant temperature performance laser

US06341137

Wavelength division multiplexed array of long-wavelength vertical cavity lasers

US06122417

WDM Multiplexer-Demultiplexer using fabry-perot filter array

US05918108

Vertical cavity surface emitting laser with enhanced second harmonic generation and method of making same

US05835517

WDM Multiplexer-Demultiplexer using Fabry-Perot filter array

US05812571

High-power vertical cavity surface emitting laser cluster

US05724375

Vertical cavity surface emitting laser with enhanced second harmonic generation and method of making same

for updates and patents pending, see: United States Patent and Trademark Office


Frank Peters (F.Peters (at) UCC.ie)

This site was last updated 16 September, 2013