|
US08488640 |
Integrated
optical comb source system and method |
|
US08300994 |
Transmitter
photonic integrated circuit (TxPIC) chip |
|
US07978981 |
Structure
and apparatus for a very short haul, free space, and fiber
optic interconnect and data link |
|
US07885492 |
Transmitter
photonic integrated circuit (TxPIC) chips |
|
US07792396 |
Probe
card for testing in-wafer photonic integrated circuits (PICs) and method of
use |
|
US07773837 |
Monolithic
transmitter photonic integrated circuit (TXPIC) with a transversely disposed
output |
|
US07747114 |
Tilted
combiners/decombiners and photonic integrated
circuits (PICs) employing the same |
|
US07680368 |
Monolithic
transmitter photonic integrated circuit (TxPIC)
with a traversely disposed output |
|
US07672546 |
Optical
transport network having a plurality of monolithic photonic integrated
circuit semiconductor chips |
|
US07555220 |
Chromatic
dispersion compensator (CDC) in a photonic integrated circuit (PIC) chip and
method of operation |
|
US07519246 |
Photonic
integrated circuit (PIC) chips |
|
US07512295 |
Transmitter
photonic integrated circuits (TXPICS) with directly modulated lasers and
wavelength selective combiners |
|
US07477807 |
Monolithic
transmitter photonic integrated circuit (TxPIC)
semiconductor chip |
|
US07444048 |
Tilted
combiners/decombiners and photonic integrated
circuit (PIC) employing the same |
|
US07437029 |
Method
of manufacturing and apparatus for a transmitter photonic integrated circuit
(TXPIC) chip |
|
US07340122 |
Monolithic
transmitter photonic integrated circuit (TxPIC)
with integrated optical components in circuit signal channels |
|
US07295589 |
Frequency
modulated vertical cavity laser |
|
US07283694 |
Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs |
|
US07236656 |
Optical transport network |
|
US07158699 |
Method of optimizing optical channel signal demultiplexing
in a monolithic receiver photonic integrated circuit (RxPIC) |
|
US07135382 |
In-wafer testing of integrated optical components in
photonic integrated circuits (PICs) |
|
US07129100 |
In-wafer testing of integrated optical components in
photonic integrated circuits (PICs) |
|
US07123786 |
Compact, cost-effective optical-electrical-optical
(OEO) converter for an optical transmission network |
|
US07116851 |
Optical signal receiver, an associated photonic
integrated circuit (RxPIC), and method improving
performance. |
|
US07116694 |
Transmitter array with pixel element that has
primary semiconductor laser and at least one secondary semiconductor laser. |
|
US07092425 |
VCSEL device with improved modal properties |
|
US07079718 |
Optical probe and method of testing employing an
interrogation beam or optical pickup |
|
US07058263 |
Optical transport network |
|
US07058246 |
Transmitter photonic integrated circuit (TxPIC) chip with enhanced power and yield without on-chip
amplification |
|
US07050719 |
Wavelength division multiplexing receiver for
wavelength tracking |
|
US07049570 |
Optical chip coupling system utilizing micromachine adjustable optical elements and a feedback
circuit providing the micromachine with a feedback
signal correlated to an optical signal parameter |
|
US07043109 |
Method of in-wafer testing of monolithic photonic
integrated circuits (PICs) formed in a semiconductor wafer |
|
US07027703 |
Method for forming and apparatus comprising optical waveguides
leading to a free space coupler region |
|
US07006719 |
In-wafer testing of integrated optical components in
photonic integrated circuits (PICs) |
|
US06999489 |
Electrical isolation of optical components in
photonic integrated circuits (PICs) |
|
US06985648 |
Method of in-wafer testing of monolithic photonic
integrated circuits (PICs) formed in a semiconductor wafer |
|
US06922422 |
Heat isolation and dissipation structures for optical
components in photonic integrated circuits (PICs) and an optical transport
network using the same |
|
US06839370 |
Optoelectronic device using a disabled tunnel junction for current confinement |
|
US06804271 |
Light emission methods and light emission devices. |
|
US06771682 |
Electrical isolation of optical components in
photonic integrated circuits (PICS) |
|
US06465811 |
Low capacitance bond pads for high speed devices. |
|
WO 01/04951 A1 |
Low capacitance bond pads for high speed devices. |
|
US06341138 |
Constant temperature performance laser |
|
US06341137 |
Wavelength division multiplexed array of
long-wavelength vertical cavity lasers |
|
US06122417 |
WDM Multiplexer-Demultiplexer using fabry-perot filter array |
|
US05918108 |
Vertical
cavity surface emitting laser with enhanced second harmonic generation and
method of making same |
|
US05835517 |
WDM Multiplexer-Demultiplexer using Fabry-Perot filter array |
|
US05812571 |
High-power vertical cavity surface emitting laser
cluster |
|
US05724375 |
Vertical cavity surface emitting laser with enhanced
second harmonic generation and method of making same |
for updates and patents pending, see: United States Patent and Trademark Office
This site was last updated 16 September, 2013